Intel® Atom® Processor E3900 Series Apollo Lake Quad Core CPU
Intel® Gen9 Graphic Performance
Extreme Ruggedized design to IEC 60068-2-64 & -40 ~ 70°C wide temperature
Rich I/O help integrators meet the demand for various applications
To fulfill wireless transmission, an external SIM slot reduces the difficulties to change SIMs, and the high gain antenna ensures the quality of the signal
Various applications: Industrial automation, Outdoor application
Waterproof & Dustproof design conforming to IP67/ IP69K
Long-term Promise of 15-Year CPU Life Cycle Until Q4′ 31 (Based on Intel IOTG Roadmap)
Multiple Expansion: 1 PCIe x16(Gen 5), 4 PCIe x4(Gen 4), 2 PCI, 2 M.2 M key, 1 M.2 E Key
Rich I/O: 2 Intel 10GbE, 2 Intel 2.5GbE, USB 3.2 Gen 2 (R680E 6x, Q670E 4x), USB 3.2 Gen1 (R680E 4x, Q670E 6x), USB 2.0 3x
Typically supports 10-Year CPU Life Cycle Until Q1’ 32 (Based on Intel IOTG Roadmap), and available for an additional 5 years support under SPS Process.
Multiple expansion: 2 PCIe x16, 2 PCIe x4, 1 M.2 E key, 2 M.2 M key, 4 SATA 3.0
I/O: 4 Intel 2.5GbE, 4 COM, 4 USB 3.2 Gen 2, 6 USB 3.2 Gen 1, 4 USB 2.0
Typically supports 10-Year CPU Life Cycle Until Q1’ 38 (Based on Intel IOTG Roadmap), and available for an additional 5 years support under SPS Process.
Multiple Expansion: 1 PCIe x16, 1 M.2 M key, 1 M.2 E Key, 1 M.2 A Key
Rich I/O: 2 Intel 2.5GbE, 2 COM, up to 2 USB 3.2 Gen2, 4 USB 3.2 Gen1, 2 USB2.0 headers
Typically supports 10-Year CPU Life Cycle Until Q1’ 38 (Based on Intel IOTG Roadmap), and available for an additional 5 years support under SPS Process.
